Intel is partnering closely with ASML to assure the success of this industry breakthrough beyond current generation of EUV.Īdmittedly, the whole idea is less for the likes of us and is more about marketing itself to potential customers for its fledgling foundry business. Intel is also working to define, build and deploy next –generation High NA EUV, and expects to receive the first production tool in the industry. 2025 and Beyond: Beyond Intel 20A, Intel 18A is already in development for early 2025 with refinements to RibbonFET that will deliver another major jump in transistor performance.PowerVia is Intel’s unique industry-first implementation of backside power delivery, optimizing signal transmission by eliminating the need for power routing on the front side of the wafer. The technology delivers faster transistor switching speeds while achieving the same drive current as multiple fins in a smaller footprint. RibbonFET, Intel’s implementation of a gate-all-around transistor, will be the company’s first new transistor architecture since it pioneered FinFET in 2011. Intel 20A ushers in the angstrom era with two breakthrough technologies, RibbonFET and PowerVia.Intel 3 will be ready to begin manufacturing products in the second half of 2023.
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